Microsemi has unveiled its new 65nm embedded flash platform, on which the company's next-generation flash-based customizable SOCs (system-on-chips) will be built. Featuring a new, expandable 4-input LUT architecture, the company's low power, intelligent mixed signal and system critical series of SOCs will converge on 65nm embedded flash process. Densities will increase an order of magnitude, offering twice the performance when compared to the previous generation. The new platform will maintain the company's low-power leadership, providing 65-per cent lower dynamic power while enhancing the Flash Freeze feature to provide lower static current. Future devices will include industry-standard bus interfaces and also allow integration of hardened intellectual property such as embedded microprocessor cores, DSP blocks, high-speed transceivers, memory interfaces, non-volatile flash memory and programmable analog.
"More and more, the demand for low power, firm error immunity, security and integration are non-negotiable in today's designs," said Esam Elashmawi, Vice-President, Product Development, Microsemi's SoC Products Division. "With the move to 65nm, the increase in density and improvements in power and performance allow us to target a much larger portion of the industrial, medical, mil/aero, avionics, communications and consumer markets."
Microsemi's SOC Products Division is concurrently launching its customer lead programme for early adopters in the commercial and industrial markets who want early access to emerging technology for their next-generation designs.
