Qualcomm has announced that the Company has shipped its first dual-CPU Snapdragon chipsets. The Mobile Station Modem (MSM) MSM8260 and MSM8660 solutions integrate two of the Company's enhanced cores running at up to 1.2GHz. Targeted at enabling high-end smartphones, the MSM8x60 solutions are third-generation chipsets from the Company's expanded Snapdragon platform.
"Qualcomm's first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume," said Steve Mollenkopf, Executive Vice-President of Qualcomm & President of Qualcomm CDMA Technologies. "We are very excited by the innovations our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets."
The MSM8260 for HSPA+ and MSM8660 for multi-mode HSPA+/CDMA2000 1xEV-DO Rev. B feature two enhanced CPU cores running at up to 1.2GHz for high levels of Web application and multimedia performance, including a powerful GPU with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 accelration, 1080p video encode/decode, dedicated low-power audio engine, integrated low-power GPS and support for 24-bit WXGA 1280 x 800 resolution displays.
