Texas Instruments (TI) has introduced two new power management integrated circuits for point-of-load designs that raise the bar for size, power density and performance. TI's TPS82671 and TPS84620 integrated power solutions ease design and speed time-to-market in portable electronics, communications and industrial applications.
"Point-of-load designs require greater power density, high efficiency and ease of use," said Sami Kiriaki, Senior Vice-President, TI’s Power Management business. "These two new power devices achieve new levels of integration and performance, and allow us to support a wide range of customers in portable, telecom, base station and industrial markets like never before," he added
The TPS82671 is an integrated plug-in power solution at 6.7 mm2, providing 90 milliamps per square millimetre. The device combines all external components in TI’s new MicroSiP package with a 1mm height easing design for 600 mA portable electronics, such as smartphones. The TPS82671 operates at a very low 17-uA quiescent current and achieves power efficiency of greater than 90 per cent from an input voltage of 2.3 V to 4.8 V. A unique PWM frequency dithering feature reduces noise and improves performance in radio frequency-sensitive designs.
TI's new 6-A, 14.5-V TPS84620 achieves a power density of greater than 800 watts per cubic inch with up to 95-per cent efficiency and 30-per cent better thermal dissipation than competitors. TI offers the broadest range of power management ICs for non-isolated point-of-load designs, including step-up and step-down converters for portable and line-powered systems.
