AMD Phenom-II X6-1100T Black Edition CPU

The AMD Phenom II X6 processors have been favourite with the "value awared" performance enthusiast audience, especially those people who love the idea of having six physical cores. AMD is refreshing its lineup of desktop six-core processor offerings with a brand new flagship CPU, dubbed the Phenom II X6 1100T Black Edition. As you can make out from its name, the 1100T is clocked higher than the 1090T it will be supplanting at the top of AMD's lineup and its "Black Edition" moniker denotes an unlocked chip for more flexible overclocking.

The AMD Phenom II X6 1100T Black Edition is based on the same Thuban core as the previous Phenom II X6 processors and differs from the 1090T only in its clock speeds. As you can see in the specifications above, the Phenom II X6 1100T Black Edition has a 3.3GHz “base” clock frequency with a peak Turbo Core frequency of 3.7GHz - the 1090T tops out at 3.2GHz / 3.6GHz. The chip, like other Phenom IIs, is manufactured on Global Foundries' 45nm SOI process node and it is comprised of roughly 904 million transistors, with a die size of approximately 346mm2. The bandwidth across the various links to memory and the rest of the system remains unchanged from the 1090T, as does the max TDP of 125 watts.

• Model Number & Core Frequency: X6 1100T / 3.7GHz (Turbo) / 3.3GHz (Base)
• OPN: HDE00ZFBK6DGR
• L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (768KB total L1 per processor)
• List Item 1
• L2 Cache Sizes: 512KB of L2 data cache per core (3MB total L2 per processor)
• L3 Cache Size: 6MB (shared)
• Total Cache (L2+L3): 9MB
• Memory Controller Type: Integrated 128-bit wide memory controller
• Memory Controller Speed: Up to 2.0GHz with Dual Dynamic Power Management
• Types of Memory Supported: Unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
• HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
• Total Processor-to-System Bandwidth: Up to 37.3GB/s total bandwidth [Up to 21.3 GB/s memory bandwidth (DDR3-1333) + 16.0GB/s (HT3)] Up to 33.1GB/s total bandwidth [Up to 17.1 GB/s memory bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
• Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
• Fab location: GLOBALFOUNDARIES Fab 1 module 1 in Dresden, Germany
• Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
• Approximate Die Size: 346mm2
• Approximate Transistor count: ~904 million
• Max TDP: 125 Watts