Elpida Memory Inc. has developed a memory chip package that is 20% thinner than similar packages on the market, a breakthrough that the company reveals will help make mobile gadgets thinner while maintaining their memory capacity. Elpida the new one-gigabyte package containing four stacked chips is the world's thinnest DRAM package of its kind.
The company claims, that it is designed for smartphones and other mobile devices, is 0.8 millimetre thick, compared with existing similar packages that are one millimetre thick. Elpida plans to start mass producing and shipping the new chip package from the July-September quarter.
