STM participates at IBC 2012

STMicroelectronics (STM) will exhibit a cable modem meeting the latest DOCSIS 3.0 specifications at IBC 2012.

The company claims that DOCSIS 3.0 modem is capable to bond sixteen downlink channels and four uplink channels to achieve data speeds of 800Mbps downstream and 108Mbps upstream.

Laurent Remont, Digital Convergence Group VP and Unified Platform Division General Manager, STM, stated, “DOCSIS 3.0 specification defines the functionality and performance that cable operators need to innovate and enhance services going forwards.” 

Based cable modem technology DOCSIS 3.0 is coupled with a dual-core ARM Cortex-A9 processor and has applications in routing, switching, telephony, security and media-server functions. 

“Our DOCSIS 3.0-based technology outperforms all others currently available, and will empower ST customers to create advanced products capable of delivering high-quality content and new services such as home automation, home security and e-Health,” Laurent adds.

ST’s DOCSIS 3.0 is also equipped with additional multimedia support and security algorithms for pay-TV and Internet-based services.