STMicroelectronics has announced its association with research partners for a project to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU). Lab4MEMS project is one of the Key Enabling Technologies (KET) Pilot-Line projects contracted by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU) to develop technologies and application areas with substantial societal impact.
The project will develop technologies such as Piezoelectric (PZT) thin films to enhance current pure-silicon MEMS, enabling improvements such as larger displacement, higher sensing functionality and greater energy density.
The project will also develop advanced packaging technologies and vertical interconnections using flip-chip, through-silicon vias and through-mold vias, enabling 3D-integrated devices for applications such as body area sensors and remote monitoring. The main aim of this project is to perfect a PZT deposition process compatible with mass production, and integrate it into complex MEMS processes to enable innovative actuators and sensors on System-On-Chip industrial products.
Roberto Zafalon, European Programs Manager, R&D and Public Affairs, STMicroelectronics said, “The ENIAC JU research agenda has synergies with ST’s commitment to improving quality of life through technology. Lab4MEMS is an important project that will benefit consortium members and stakeholders, including ENIAC member states. Ultimately, we expect the results to translate into long-term prosperity and valuable knowledge-based employment opportunities.”
The ENIAC JU partnership involves ENIAC member states, the European Union, and the Association for European Nanoelectronics Activities (AENEAS).
