Skip to main content
VARINDIA
Breaking
Image Gallery

Telit to Expand its Mobile Computing Offerings

2 min read0 views
Telit to Expand its Mobile Computing Offerings

Telit Wireless Solutions has announced the introduction of a family of new data cards in the new M.2, Next Generation Form Factor (NGFF). The data cards augment the company’s mobile computing product line currently comprised of mPCIe modules in HSPA+ and 1xEvDO cellular technologies. The new data cards are to be based on Intel’s designs for LTE/DC-HSPA+ and HSPA+. They target not only new always-connected consumer and leading edge adopter applications such as Ultrabook, laptops, tablets, but also commercial and industrial devices, as the current favored mPCIe form factor gets gradually replaced by M.2.

 

.Telit’s new M.2 lineup will include LN930 and HN930 product families conceived to address both global, regional, and speed requirements from cutting edge LTE/DC-HSPA+ and HSPA+ applications in mobile computing and gadgets. The Intel based LTE products are set todeliver speeds up to 100 Mbps down and 50 Mbps up; Dual Carrier HSPA+ 42 Mbps down and 11.5 Mbps up; and HSPA+ 21 Mbps down and 5.76 Mbps up.

 

The sub-compact and ultra slim 30x42mm M.2 data cards include global satellite (and assisted) positioning technology and certified drivers for Windows 7 & 8. They also feature the industry’s new Firmware Switching standard enabling the host Operating System and drivers to switch the card’s firmware to the latest and specific cellular network approved revision, thus overcoming a longstanding complexity hurdle in provisioning cellular connectivity devices in non-operator branded consumer products. The switching is triggered by the simple insertion of the consumer or operator supplied SIM card into the PC’s SIM card slot.

 

”Intel is pleased to be working with Telit to bring to market highly competitive modules offering worldwide coverage, high performance, and an optimized user experience,” said Horst Pratsch, head of Product Line Modules & M2M at Intel Corporation.