Hitachi GST delivers Enterprise-class SAS and FC SSDs

Hitachi Global Storage Technologies has announced its new Ultrastar solid-state drive (SSD) family. The new Ultrastar SSD400S family comes in 100GB, 200GB and 400GB capacities, featuring both 2.5-inch 6Gb/s Serial Attached SCSI (SAS) and 3.5-inch 4Gb/s Fibre Channel (FC) interfaces. As the world’s first jointly developed SAS and FC enterprise-class SSDs, the Ultrastar SSD400S family combines Hitachi’s proven enterprise hard disk drive (HDD) expertise with Intel's extensive capabilities in developing high-endurance 34-nanometer (nm), single-level cell (SLC) NAND flash memory and advanced SSD technology. This combination provides unique value to customers who are increasingly looking to tiered storage as a method of managing the escalating performance, capacity, endurance and reliability demands of today's data centers. 

"Hitachi's strategic investment and commitment in the enterprise market is evident with the new Ultrastar SSD family. Our new SSD product family not only symbolizes our market opportunity to serve evolving cloud data center infrastructures, but also delivers value to our customers in terms of increasing data center performance and reducing total cost of ownership," said Mike Cordano, Executive Vice-President of Worldwide Sales and Marketing, Hitachi GST. 

The new Ultrastar SSD400S family delivers the industry’s highest sequential throughput. It is the first to reach up to 535MB/s read and 500MB/s write throughput with 6Gb/s SAS, and 390MB/s read and 340MB/s write throughput with 4Gb/s FC. The new drive also delivers up to 46,000 read and 13,000 sustained write IOPS, reaching speeds 100 times faster than traditional hard drives, resulting in rapid response times for real-time transaction processing access to "hot" enterprise data for improved productivity and operational efficiency. As fewer SSDs are required to achieve the same HDD ultra-high performance, the new Ultrastar SSD400S family offers significant value in terms of IOPS per Watt, while reducing TCO through low-power consumption, efficient cooling and reduced space requirements.