Intel CEO to attend Odisha's 3D Glass semiconductor plant launch

Intel CEO Lip-Bu Tan is likely to visit Odisha later this year to attend the ground-breaking ceremony of 3D Glass Solutions' semiconductor plant. The ground-breaking ceremony of the silicon carbide company SicSem is scheduled for next month, and the commercial production of chips is expected to start in two years.

The 3D Glass semiconductor packaging unit will be set up by Heterogeneous Integration Packaging Solutions, which is backed by Intel, Lockheed Martin and Applied Materials, involving an investment of Rs 1,943 crore with an annual production capacity of 5 crore units.

This is the first semiconductor project, which involves personal computer chip maker Intel Corporation, along with other technology partners.

 "Chief Minister (Mohan Charan Majhi) was here, and they (SiCSem and 3DGS) have given a commitment to start the unit soon. SiCSem's ground-breaking will be done next month, and the other company, 3D Glass Solutions (3DGS), they are looking for a date from Intel CEO Lip-Bu Tan. He plans to visit Odisha also. That is when the ground-breaking will happen. Hopefully, in the next two to three months," Odisha Electronics and IT Department Principal Secretary Vishal Kumar Dev said in a statement.

SicSem Private is collaborating with UK-based Clas-SiC Wafer Fab to establish an integrated facility of SiliconCarbide (SiC) based first Compound Semiconductors fab in the country at InfoValley in Bhubaneshwar.

The Odisha government has come up with a revised semiconductor policy, which offers incentives equal to 50 per cent of the total incentive offered by the centre, along with other incentives to attract talent.