MediaTek announces LTE Modem Chipset availability
MediaTek has demonstrated its first LTE modem platform at CES 2014. The MT6290 can deliver LTE data rates as high as 150Mbit/s downlink and 50Mbit/s uplink. The chip implements FDD and TDD (Frequency Division Duplex and Time Division Duplex) modes of LTE for broad compatibility with mobile operator networks worldwide. In addition to LTE, the MT6290 also supports DC-HSPA+, W-CDMA, TD-SCDMA, EDGE and GSM/GPRS radio technologies.
The supporting RF chip in the platform is called MT6169 which supports up to 8 primary RF inputs (3 high bands, 2 mid bands, 3 low bands), plus another 8 RF inputs for diversity gains. The RF chip supports more than 30 3GPP bands and is configurable to meet the RF band needs of mobile operators globally.
Mohit Bhushan, VP & GM of MediaTek Corporate Marketing, USA, said, “MediaTek has shared its LTE plans with all the US operators, and the response has been terrific. We are now preparing to certify the MT6290 platform with all the US operators, followed by commercialization of MT6290-enabled data devices within 2014.”
Besides LTE modem, MediaTek has also demonstrated a wide range of other innovative products and technologies at CES, including mobile SOCs, new Home Entertainment, Connectivity, Wireless Charging and Internet of Things solutions.
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