Rigaku unveils ONYX 3200 to advance precision in semiconductor manufacturing

The new ONYX 3200 metrology system is designed to improve yield and quality in advanced semiconductor packaging and BEOL processes by enabling precise, non-destructive measurement of ultra-fine metal layers and interconnect structures.

Rigaku Corp., a global solution partner in X-ray analytical systems and part of Rigaku Holdings Corp., has launched the ONYX 3200, a next-generation semiconductor metrology system aimed at addressing growing complexity in chip manufacturing. The new platform is designed to support wafer-level processes by accurately measuring film thickness, material composition, and microscopic bump structures used in advanced packaging and back-end-of-line (BEOL) production.

As demand surges for artificial intelligence, high-performance computing, data centres, and advanced mobile devices, semiconductor interconnects have become thinner and more intricate. Manufacturers now require highly precise and non-destructive measurement tools to ensure reliability, as even minor variations in metal wiring or bumps can significantly impact final device performance. The ONYX 3200 is built to meet these stringent requirements, enabling stable quality control and improved production yields.

Advanced measurement capabilities

A key strength of the ONYX 3200 lies in its ability to measure complex bump structures using a single system. Traditionally, analysing multiple metal layers required several instruments. Rigaku’s new solution integrates a 3D confocal optical scanner with fluorescent X-ray technology, allowing detailed inspection of bump shape, height, and metal layer thickness. This combined approach enables accurate calculation of underlying copper or nickel layers beneath tin and silver coatings, helping manufacturers ensure robust interconnect reliability.

The system also features a proprietary dual-head, microfocus X-ray source. This allows precise detection of material ratios in tin-silver bumps, including silver content as low as 2 percent, with extremely high accuracy. Such control is critical for maintaining packaging strength and long-term device performance, while also improving throughput and analytical flexibility.

Adoption and market outlook

Rigaku has already shipped the first ONYX 3200 unit to a major global foundry for use in advanced packaging lines. Interest from leading semiconductor manufacturers is growing, reflecting rising demand for sophisticated metrology solutions. The company expects ONYX 3200 sales to reach JPY 1.5 billion in FY2026 and plans to double revenues to JPY 3 billion in FY2027 as adoption expands across BEOL and packaging applications.