Telit  a global enabler of the Internet of Things (IoT), has announced commercial availability of the UE866-EU, an HSPA module banded for European and Asian markets.
With its ultra-compact 15x25mm LGA footprint, the new module is ideal for IoT applications withstringent space constraints such as telematics OBDII dongles,health monitoring devices and connected wearables.
Leveraging a hardware and software platform design validated in more than eight million shipped modules, the UE866-EU dual-band HSPA module with fallback to GSM/GPRS provides system integrators with a proven,long-term deployment option for a wide range of IoT applications.
The Telit IoT Portal-ready UE866-EUalso enables solution providers to take direct advantage of Telit IoT Connectivity and IoT Platform services designed for hassle-free device-to-cloud onboarding. Telit’s “design once and deploy globally†development philosophy makes it easy for customers to deploy devices anywhere in the world by simply selecting regional or technology variants from the same form factor family.
Ronen Ben-Hamou, executive vice president, Products and Solutions, Telit said, “New technology and strategies we developed here will enable us to keep bringing extraordinary breakthroughs in module miniaturization as we reaffirmour commitment to innovation leadership in the IoT.â€
The UE866-EU is adual-mode, dual-band UMTS|HSPA, GSM|GPRS,3GPP Release 7 compliant module. It supports 3G 900/2100MHz and 2G 900/1800MHz bands, delivering 7.2 Mbps downlink and 5.76 Mbps uplink data rates. The new module supports application development inside module through the Telit AppZone application development environment, includes digital voice support and is ideal for new and upgrade designs, particularly forredesign projects aiming at reducing bill of material costs and/or device dimensions.
