OmniVision Technologies has introduced world’s first 1.1-micron backside illumination (BSI) pixel. The new OmniBSI-2 pixel architecture represents a major milestone in digital imaging technology, and enables new imaging solutions with superiorimage quality and low-light sensitivity. The architecture also extends OmniVision’s pixel roadmap to sub-micron levels, and serves as a key enabler in the continuous miniaturization of digital imaging technology.
“OmniBSI-2 drives the development of higher resolution image sensor solutions with an aggressive form factor and lower z-height for ultra-thin products. OmniBSI-2 technology can also be applied to larger pixel designs to achieve performance advantages that exceed current BSI and FSI imaging sensors,” said Bruce Weyer, Vice-President – Worldwide Marketing, OmniVision.
OmniBSI-2 is OmniVision’s second-generation BSI technology, and is the first pixel built on a 300-mm copper process at 65 nm design rules developed in cooperation with strategic manufacturing partner, Taiwan Semiconductor Manufacturing Company Limited (TSMC). By combining custom 65 nm design rules and new manufacturing process modules, the 1.1-micron OmniBSI-2 pixel achieves industry-leading low-light sensitivity as well as significantly improved dark current and full-well capacity. OmniBSI-2’s custom pixel design rules also enable better pixel layout, better isolation, and significantly reduced crosstalk. Each of these advances represents a substantial improvement over the first-generation OmniBSI technology, resulting in better image quality, enhanced colour reproduction and improved camera performance.
“In comparison, the new 1.1-micron OmniBSI-2 pixel not only outperforms our current 1.75-micron FSI architecture, but it also equals the performance of our 1.4-micron BSI pixel that is currently in mass production,” commented Dr. Howard Rhodes, Vice- President – Process Engineering, OmniVision. “Migrating to 1.1-micron BSI pixel architecture required moving production to TSMC’s state-of-the-art 300-mm copper process, which enabled substantially improved design rules and more advanced process tools, resulting in tighter process control and improved defect density.
OmniVision’s new OmniBSI-2 technology will be demonstrated to the customers by appointment at the Mobile World Congress, February 15 through 18, 2010 in Barcelona, Spain.
