To meet the ultra-small requirements and design creativity for the next-generation of portable consumer devices, STMicroelectronics has announced a new ST patented technology that isolates the pressure-sensing element within a fully molded package.
The new technology enables fully encapsulated wire bonding with zero risk of corrosion, elimination of wire bonding damage during pick and place assembly, zero risk of cap detachment or cap damage while the device is being mounted, and no impact on the sensor from the soldering process to ensure a more robust packaging solution.
This technology represents a revolution in the enhancement of performance and quality for pressure sensors. STMicroelectronics pioneered the use of fully molded packages without gel for high volume manufacturing for Accelerometers and Gyroscopes. We are now leveraging this knowledge to revolutionize the packaging in the emerging field of pressure sensors where STMicroelectronics is the first to use a fully molded package without gel for a high-performance pressure sensor with enhanced accuracy, said Benedetto Vigna, Executive Vice-President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics.
The new technology enhances accuracy while continuing to offer zero drift, low noise and a simplified calibration system, making it ideal for a broad range of consumer, automotive and industrial applications including indoor/outdoor navigation, location-based services, enhanced GPS dead-reckoning, altimeter and barometer functions, weather station equipment, and healthcare applications.
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