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LTSCT Joins imec Automotive Chiplet Program

L&T Semiconductor Technologies has announced that it is joining the imec ‘Automotive Chiplet Program’ (ACP), a pre-competitive research initiative uniting stakeholder across the global automotive value chain.

ACP evaluates chiplet architectures and advanced packaging technologies to meet automakers’ demanding performance, functional-safety, reliability and lifecycle requirements — while enabling the flexibility, scalability and cost efficiencies associated with chiplet-based systems.

For decades, automakers have relied on semiconductors to power vehicle electronics. However, traditional monolithic SoC approaches are increasingly challenged by the compute and bandwidth demands of advanced driver-assistance systems (ADAS), software-defined vehicles (SDVs) and next-generation in-vehicle infotainment (IVI). Chiplets — modular silicon building blocks optimised for specific functions and interconnected through advanced 2.5D and 3D packaging — offer a new paradigm that delivers higher performance per watt, faster time-to-market and greater supply-chain resilience.

Sandeep Kumar, Chief Executive - LTSCT, said: “Chiplets represent a fundamental shift in how performance and integration are delivered in automotive systems. As vehicle architectures become increasingly software-defined, modular and scalable hardware becomes critical”.

He further added: “Through the collaboration with imec and the ACP partners, LTSCT aims to help define the standards and reference designs that will drive the next generation of high-performance, energy-efficient automotive platforms. Our participation will emphasise safety-critical compute partitions, high-bandwidth die-to-die links and robust test/monitoring concepts from wafer to in-field operation. We intend to contribute practical viewpoints from productisation — covering qualification, diagnostics and lifecycle management in real automotive environments”.

“We are delighted to welcome LTSCT — India’s largest semiconductor product company — to the Automotive Chiplet Program”, said Bart Placklé, Vice President of Automotive Technologies at imec. “Transitioning to chiplet architectures is prohibitively expensive if pursued by OEMs in isolation. Commercial viability depends on industry-wide alignment around interoperable chiplet standards that allow carmakers to integrate off-the-shelf and proprietary chiplets seamlessly into unique systems. The Chiplet reduces vendor lock-in, enhances supply-chain flexibility and improves energy and spatial efficiency — key enablers of more compact and sustainable vehicle platforms”, he added.

The ‘Automotive Chiplet Program’ leverages imec’s world-leading expertise in advanced 2.5D/3D packaging and its broad ecosystem across the semiconductor and automotive industries.

With its entry into the imec ‘Automotive Chiplet Program’, LTSCT reinforces its commitment to advancing India’s role in the global semiconductor ecosystem. By contributing to open chiplet standards and collaborating with leading automotive and technology innovators, LTSCT aims to accelerate the path toward safer, smarter and more sustainable vehicles worldwide.