Telit expands service portfolio for M2M markets

Telit Wireless Solutions has announced the introduction of the UE910V2HSDPA and HE910V2HSPA+ modules based on Qualcomm Technologies, Inc. chipsets, each to be banded for European and North American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE support. The entry-level 3GUE910V2 is based on Qualcomm Technologies’ QSC6270 chipset and delivers a top 3.6Mbps downlink data rate. The HE910V2 is based on Qualcomm Technologies MDM6200 chipset and delivers up to 14.4Mbps downlink and 5.76Mbps uplink data rates.

 The new products are fully compatible with Telit’s xE910 family and can be easily dropped into existing or planned designs for xE910 modules requiring no additional rework. Positioned at entry-level and mid-range respectively, the new Qualcomm Technologies-based UE910 V2 and HE910 V2 modules enable the Telit xE910 family to enhance cross-technology compatibility with its other popular global air-interface technologies. The application of the Qualcomm Technologies chipsets improves interchangeability between CDMA (1xRTT, EV-DO) and UMTS (HSDPA, HSPA+) variants making the adaptation of customer applications to regional technical requirements quick and easy, minimizing time to market and total cost of ownership.

 Both the UE910 V2 and HE910 V2 will be available in local band-group variants as required for all major carriers and partner networks in North America and Europe. The Qualcomm Technologies-based products will be available in North America with 850/1900MHz and in Europe with 900/2100 MHz dual-band combinations. Both regional variants will be available in data-only as well as data & voice variants.

 “The Qualcomm Technologies-based entry-level 3GUE910V2 and mid-rangeHE910V2 are Telit’s new 3G products launched in response to increasing demand for dual-band HSDPA, and HSPA+ modules,” said Dominikus Hierl, Chief Marketing Officer at Telit Wireless Solutions.

 Hierl further added that Qualcomm Technologies’ fully-integrated QSC6270, QSC6270-Turbo and MDM6200 chipsets support the bandwidth and feature requirements of a broad range of M2M applications, and we are pleased to enable  HSDPA, HSUPA and HSPA+ products in the xE910 family.